Molex, a leading supplier of interconnect products, has used DSM's PC/ABS-based LDS technology for the production of a mobile phone antenna. This grade was selected because it provides excellent plating properties, ductility/high-impact performance (it passes the usual mechanical tests for mobile phones) and surface appearance. Overall, Xantar LDS 3710 outperforms alternative materials in both ductility and/or surface appearance.

The antenna function is made by means of laser direct structuring (LDS) on a moulded part. LDS is a simple and precise technology used for producing 3D-moulded interconnects devices. After moulding, the interconnect pattern is directly written on the part and the conductive paths are plated where the plastic has been activated by the laser. The part is subsequently fixed in the housing of the mobile phone.