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What are the reliability tests in the chip development process


First, the chip reliability test than the common several kinds of test:
Acceleration test: in semiconductor devices, some common acceleration factors are temperature, humidity, voltage and current. In most cases, accelerated testing does not change the physical characteristics of the fault, but will change the observation time. The change between accelerated conditions and normal use conditions is called "derating". High acceleration testing is a key part of JEDEC-based qualification testing.
Temperature Cycling: According to the JED22-A104 standard, Temperature Cycling (TC) exposes components to transitions between extreme high and low temperatures. The test is performed by repeatedly exposing the part to these conditions for a predetermined number of cycles.
High Temperature Operating Life HTOL: HTOL is used to determine device reliability under high temperature operating conditions. This test is typically performed over a long period of time according to the JESD22-A108 standard.
Temperature Humidity Bias Accelerated Stress Test BHAST: In accordance with JESD22-A110, THB and BHAST subject devices to high temperature and high humidity conditions while under bias, with the goal of accelerating corrosion of the device.THB and BHAST are used for the same purpose, but the BHAST conditions and test procedure allow reliability teams to test much faster than THB.
Thermobarrel/Unbiased HAST: Thermobarrel and unbiased HAST are used to determine device reliability under high temperature and high humidity conditions. Like THB and BHAST, it is used to accelerate corrosion. However, unlike these tests, no bias is applied to the part.
High Temperature Storage: HTS (also known as "bake-out" or HTSL) is used to determine the long-term reliability of devices at high temperatures. Unlike HTOL, the device is not subjected to operating conditions during testing.

Electrostatic Discharge ESD: An electrostatic charge is an unbalanced charge at rest. Typically, it is generated by insulator surfaces rubbing against or separating from each other; one surface gains electrons while the other loses them. The result is an unbalanced electrical condition called an electrostatic charge.
When an electrostatic charge moves from one surface to another, it becomes an electrostatic discharge (ESD) and moves between the two surfaces in the form of a miniature lightning bolt.

As the electrostatic charge moves, an electric current is formed and can therefore damage or destroy gate oxides, metal layers and junctions.

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